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Volta 晶圆级芯片封装探针头

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Volta 系列探针头
  • 适用于最小引脚间距(pitch)180µm及以上测试
  • 可以满足在750,000次寿命测试下仍保持低且稳定的电阻
  • 卓越的针头共面性可满足64 个工位,5000根探针同时进行测试
  • 模组化的针头设计能确保维护时可进行快速更换,停机时间几乎为零
  • 全探针阵列设计允许现场根据不同产品配置探针位置

史密斯英特康的浮动弹簧探针设计具有高度精确度,因此能在测试晶圆级芯片封装尺寸时实现无缝部署。

史密斯英特康已面向各类应用生产了数以千计的探针头。在晶圆级别测试Volta产品线,我们增加了针对更小引脚间距测试的的晶圆尺寸,晶圆级芯片封装(WLCSP)和已知合格芯片的Volta180系列。

Volta180 系列探针卡具有优越的直流电和射频性能,提高了探针头的使用寿命和延长单次正常运行时间,并且易于维护。

  Volta 180 Volta 200 Volta 250 Volta 300 Volta 350 Volta 400
Wafer I/O Pitch 180 μm 200 μm 250 μm 300 μm 350 μm 400 μm
Minimum Probe Depth
(At Test)
2.85 mm 2.85 mm 2.90 mm 3.80 mm 3.50 mm 2.90 mm
Probe Travel Wafer Side 230 μm 230 μm 250 μm 250 μm 300 μm 300 μm
PCB Side 170 μm 170 μm 150 μm 150 μm 150 μm 150 μm
Spring Material music wire music wire music wire stainless steel stainless steel stainless steel
Device Side Contact Material Homogenous
Probe Tip Shape 4-Point Crown
Spring Force 6.5 gf 10 gf 15 gf 17.5 gf 16 gf 17 gf
Contact Resistance < 200 mΩ < 250 mΩ < 100 mΩ < 100 mΩ < 70 mΩ < 50 mΩ
Continuous Current Carrying Capacity (Room Temp.) 0.84 A 1.2 A 1.5 A 2 A 2.50 A 3 A
Insertion Loss
(Pattern: R-S-R @ -1 dB)
20 GHz 22 GHz 30 GHz 20 GHz 20 GHz 20 GHz
Loop Inductance 0.65 nH 0.56 nH 0.76 nH 0.95 nH 0.92 nH 0.82 nH
Capacitance 0.40 pF 0.22 pF 0.31 pF 0.39 pF 0.41 pF 0.30 pF
Working Temperature -55° to120°C -55° to 120°C -55° to 120°C -55° to 150°C -55° to 150°C -55° to 150°C
Max. Number of Test Sites Defined by the FEA [Total pin count at a defined area is the limit]
Sorted Die Test Feature (Alignment Plate and Manual Actuator) Yes
Individual Contact Replacement Yes